Advanced Micro Devices (AMD) announced new investments exceeding $10 billion in Taiwan's technology ecosystem. This investment aims to expand strategic partnerships and enhance advanced manufacturing and packaging capabilities to support next-generation AI infrastructure.

The company confirmed it is working with its strategic partners in Taiwan and globally to develop cutting-edge chip, packaging, and manufacturing technologies, enabling higher performance, greater efficiency, and faster deployment of modern AI systems. This move builds upon AMD's extensive expertise in chip architecture, HBM memory integration, 3D hybrid bonding technologies, and rack-scale infrastructure design.

Dr. Lisa Su, Chairwoman and CEO of AMD, stated that the accelerating adoption of artificial intelligence (AI) is driving customers globally to expand their computing infrastructure at an accelerated pace to meet the growing demand for processing power.

She added that combining AMD's expertise in high-performance computing with its Taiwanese technology ecosystem and global partners will deliver a comprehensive, rack-scale AI infrastructure, helping customers accelerate the deployment of next-generation AI systems.

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part of its new investments, AMD announced a collaboration with ASE Technology and Siliconware Precision Industries, along with several industry partners, to develop and adopt next-generation EFB connectivity technology based on 2.5D packaging.